TSMC has taken the unusual step of opening up its Chip-on-Wafer-on-Substrate (CoWoS) outsourcing opportunities and recently ...

TSMC's leadership in advanced node processors (N2/A16) and advanced packaging technologies (CoWoS) positions it as a near-monopoly in leading-edge process technology. The global semiconductor ...

Utilizing TSMC’s CoWoS 2.5D silicon-interposer-based packaging, the fully integrated and highly configurable subsystem delivers a high bandwidth density of 8 Tbps/mm while optimizing I/O ...

such as TSMC’s Integrated Fan-Out (InFO) and Chip on Wafer on Substrate (CoWoS). CoWoS could also hold interesting opportunities for Apple, as it’s an advanced chip packaging tech that can ...

Credit: Rattanathip - adobe.stock.com Built on TSMC’s Chip-on-Wafer-on-Substrate (CoWoS) advanced packaging technology this complete PHY and controller subsystem, developed in close collaboration with ...

The tapeout of the test chip featuring a multi-die design using TSMC’s CoWoS packaging technology sets the stage, said Synopsys, for billion-to-trillion transistor designs in the future. The test chip ...

When you buy through links on our articles, Future and its syndication partners may earn a commission. When Amkor announced plans to build a $1.6 billion chip test and packaging facility near ...

Utilizing TSMC’s CoWoS 2.5D silicon-interposer-based packaging, the fully integrated and highly configurable subsystem delivers a high bandwidth density of 8 Tbps/mm while optimizing I/O complexity, ...